Accession Number:

AD0731413

Title:

Fatigue Crack Propagation in Copper and Copper-Aluminum Single Crystals No. 2.

Descriptive Note:

Technical rept.,

Corporate Author:

NORTHWESTERN UNIV EVANSTON ILL DEPT OF MATERIALS SCIENCE

Personal Author(s):

Report Date:

1971-09-01

Pagination or Media Count:

45.0

Abstract:

The effect of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation was studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. A stress intensity factor was used to normalize the crack propagation data. It was found that dislocation cross slip plays a critical role on the rate of fatigue crack propagation. Existing mathematical crack propagation formulae could not explain the data on single crystals. A new fatigue crack propagation model to explain the observed results is proposed. Author

Subject Categories:

  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE