Conductive, Lusterless Coatings for Light Metals.
Final rept. 1 Jul 70-30 Jun 71,
BATTELLE MEMORIAL INST COLUMBUS OHIO COLUMBUS LABS
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A process for electrodepositing lusterless, conductive coatings on light metals was developed. The objectives were to 1 identify satisfactory ranges of operating conditions and composition for electroplating lusterless nickel and 2 eliminate zinc and copper undercoats in order to improve corrosion resistance. Ranges were established for the current density and temperature of the porous nickel plating process and for the appropriate concentration of activated carbon to produce a conductive, abrasion-resistant, lusterless coating which is expected to be useful for camouflaging electronic gear in field applications. Representative aluminum electronic hardware parts were plated with the coating. Zinc and copper undercoats were eliminated by depositing nickel adherently on aluminum after it was conditioned anodically in sodium carbonate solution. The results of accelerated corrosion tests indicate improved durability in corrosive atmospheres. Investigation of analogous procedures for plating nickel on magnesium was unsuccessful. Author
- Coatings, Colorants and Finishes
- Fabrication Metallurgy