The Dislocation Cell IZE AND Dislocation Density in Copper Deformed at Temperatures between 25 and 700 Degrees C.
MASSACHUSETTS INST OF TECH CAMBRIDGE DEPT OF METALLURGY AND MATERIALS SCIENCE
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A dislocation cell structure was developed in polycrystalline OFHC copper by deforming tensile specimens 10 percent, one at each of the following temperatures 25, 250, 400, 500, 550, 600, 650 and 700C. The dislocation cell size and the dislocation density were measured by transmission electron microscopy. The mean cell diameter increased with increasing temperature from 1.4 micrometers at 25C to 6.0 micrometers at 700C. The dislocation density rho decreased with increasing temperature, from 118.0 x 10 to the 8th power cmcc at 25C to 10 to the 8th power cmcc at 700C. The thickness of the cell walls decreased with increasing temperature of deformation. It was found that the mean cell diameter d was related to the dislocation density rho through the relation d 16.2 rho to the -12 power. The occurrence of such a relation supports a theory in the literature of dislocation cell formation. The flow stress tau was given by tau 10.5 Gbd and tau .575 Gb rho to the 12 power where G is the shear modulus and b is the Burgers vector. Author
- Metallurgy and Metallography
- Solid State Physics