Multilayer Printed Wiring Board Design Standard.
Quarterly progress rept. no. 1, 5 Jan-5 Apr 70,
MARTIN MARIETTA CORP ORLANDO FLA
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The purpose of the effort is to determine the material characteristics that the designer must specify when designing multilayer printed wiring boards. Military contract reports and industry association specifications and standards have been reviewed. Testing of prepreg materials to determine the relationship of the percent of retained resin and pressed thickness is well along. A partial draft of material considerations for inclusion in the subject design standard is presented. Author
- Electrical and Electronic Equipment