Multilayer Printed Wiring Board Design Standard.
Quarterly progress rept. no. 3, 5 Jul-2 Oct 70,
MARTIN MARIETTA CORP ORLANDO FLA
Pagination or Media Count:
The relationship between percent resin flow, percent resin retained, percent copper circuit retained, and processed thickness has been established and is presented in graph and table form. A basic standardized computer aided design language is described. An outline of the material covered in the recently submitted Design Standard draft is presented. Author-PL
- Electrical and Electronic Equipment
- Laminates and Composite Materials