Accession Number:

AD0725990

Title:

Multilayer Printed Wiring Board Design Standard.

Descriptive Note:

Quarterly progress rept. no. 3, 5 Jul-2 Oct 70,

Corporate Author:

MARTIN MARIETTA CORP ORLANDO FLA

Personal Author(s):

Report Date:

1970-10-01

Pagination or Media Count:

31.0

Abstract:

The relationship between percent resin flow, percent resin retained, percent copper circuit retained, and processed thickness has been established and is presented in graph and table form. A basic standardized computer aided design language is described. An outline of the material covered in the recently submitted Design Standard draft is presented. Author-PL

Subject Categories:

  • Electrical and Electronic Equipment
  • Laminates and Composite Materials
  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE