Accession Number:

AD0724980

Title:

Hybrid Thin Film Circuits,

Descriptive Note:

Corporate Author:

FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OHIO

Personal Author(s):

Report Date:

1971-01-29

Pagination or Media Count:

16.0

Abstract:

Based on published data, a general description of hybrid thin-film circuits is given. Circuits with discrete active elements initial data required for designing such elements is listed. Construction of circuits with discrete active elements typical structures with and without housing methods of connections. Topology of the circuits with discrete active elements sixteen rules for developing the topology are given. Methods of connecting microcircuits with hang-on components pressure, ultrasonic, and laser welding methods are most widely used for connections. Monolithic thin-film circuits mounting of active and passive elements on a Si-chip is explained distinctive features of transistors and planar diodes volume resistors, diffusion resistors, diffusion capacitors insulation of chips. Hybrid structures monolithic circuits combined with semiconductor components several integrated circuits in one housing. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE