UHF MOS Integrated Circuits.
Quarterly rept. no. 11, 1 Oct-31 Dec 70,
RCA SOLID STATE DIV SOMERVILLE N J
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Two ceramic carriers were designed and batch fabricated to accommodate beam-leaded UHF MOS transistors. One approach requires a receptacle hole to be formed in the ceramic piece. This approach is attractive because it is ideally adaptable for use in UHF integrated circuits. The other approach is a thick-plate, planar approach that is amenable to large batch fabrication techniques. It too is adaptable for use in UHF integrated circuits but electrical grounding requires detailed consideration. Initial results with the planar approach are very encouraging. Author
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass