Accession Number:

AD0722405

Title:

Thermal Analysis. Advanced Autopilot Flatpak Module Design Recommendations,

Descriptive Note:

Corporate Author:

GENERAL DYNAMICS/CONVAIR SAN DIEGO CALIF

Personal Author(s):

Report Date:

1967-12-01

Pagination or Media Count:

38.0

Abstract:

A thermal model of a typical electronic flatpak module was constructed and analyzed. Polyurethane foam and aluminum-filled epoxy were assessed for use as encapsulation materials. The value of utilizing copper sheets as heat conductive paths from heat generators to the flatpak frames was assessed. From a large number of digital computer calculations, accumulated data were correlated with some preliminary test data. With this information, design recommendations were made to assist the flatpak designer. In general, the economics of material and fabrication costs must be compared, by the designer, with thermal characteristics of the encapsulation methods. Temperatures attained by critical heat generating elements are dependent upon 1 location relative to the flatpak frame, 2 length of electrical leads and connections, and 3 contact resistances of the electrical connections and heat conductive sheets. Recommendations include a tabulation of allowable thermal resistance for each heat generator configuration. Author

Subject Categories:

  • Flight Control and Instrumentation
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE