Reliability Evaluation of Plastic Integrated Circuits.
Final rept. 9 Jan 69-9 Sep 70,
GENERAL MOTORS CORP KOKOMO IND DELCO ELECTRONICS DIV
Pagination or Media Count:
The objectives of this study are to determine the suitability of representative,plastic-encapsulated integrated circuits for military applications, and to develop methods and techniques for assessing and assuring the reliability of such circuits. A series of screens and tests were performed on selected circuits, and detailed failure analyses were made to determine the failure modes and mechanisms characteristic of the various types of plastic encapsulations. This report includes detailed test results from long term tests and from short term highly accelerated tests. Comparisons are made between package types under the same stress conditions, between screened and unscreened groups, and between standard and accelerated test results. A stress to destruction test program, including equivalent hermetic types for direct comparison with plastic- encapsulated devices under selected accelerated test conditions, was also performed. Author, modified-PL
- Electrical and Electronic Equipment