Accession Number:

AD0716334

Title:

Collocated Interfacial Stress Intensity Factors for Finite, Bi-Material Plates,

Descriptive Note:

Corporate Author:

BALLISTIC RESEARCH LABS ABERDEEN PROVING GROUND MD

Personal Author(s):

Report Date:

1970-09-01

Pagination or Media Count:

35.0

Abstract:

The paper examines elastic stress intensity factors associated with partially debonded interfaces in finite, bi-material plates. Bi-material stress intensity factors K1 and K2 are functions of an arbitrary length parameter certainly any fracture condition involving bi-material stress intensity factors must be independent of a length parameter as in the homogeneous case. One defines a new quantity Ki called the interfacial stress intensity factor which is independent of an arbitrary length parameter. A truncated Williams power series stress function for stresses in a cracked bi-material plate, as modified by Sih and Rice, is used with an improved boundary collocation procedure to generate interfacial stress intensity factors for finite bi-material plates. This modified collocation technique eliminates the need for tuning the boundary points. The method is exemplified by application to a centrally cracked bi-material plate and to a partially debonded composite laminate. Author

Subject Categories:

  • Laminates and Composite Materials
  • Mechanics
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE