FATIGUE CRACK PROPAGATION IN COPPER AND COPPER-ALUMINUM SINGLE CRYSTALS.
NORTHWESTERN UNIV EVANSTON ILL DEPT OF MATERIALS SCIENCE
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The effects of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation have been studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. The results were discussed in terms of cyclic hardening and the case of dislocation cross slip. Author
- Solid State Physics