Accession Number:

AD0711678

Title:

FATIGUE CRACK PROPAGATION IN COPPER AND COPPER-ALUMINUM SINGLE CRYSTALS.

Descriptive Note:

Technical rept.,

Corporate Author:

NORTHWESTERN UNIV EVANSTON ILL DEPT OF MATERIALS SCIENCE

Personal Author(s):

Report Date:

1970-08-27

Pagination or Media Count:

99.0

Abstract:

The effects of crystallographic orientation, temperature and stacking fault energy on the rate of fatigue crack propagation have been studied in polycrystalline copper, copper single crystals and copper-aluminum single crystals at room temperature and at liquid nitrogen temperature. The results were discussed in terms of cyclic hardening and the case of dislocation cross slip. Author

Subject Categories:

  • Crystallography
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE