Accession Number:

AD0694554

Title:

RESEARCH AND DEVELOPMENT OF HIGH SPEED PROCESSOR ARRAYS

Descriptive Note:

Interim rept. no. 2, 22 Oct 1968-21 Jan 1969

Corporate Author:

MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Personal Author(s):

Report Date:

1969-03-01

Pagination or Media Count:

28.0

Abstract:

The reported work was performed during the second interim quarterly period of a research and development program directed toward the development of high density, high performance, complex digital arrays and their application in high speed system feasibility studies. During this interim, high speed ECL microcircuit cells of several designs were fabricated and characterized. Specific gate and reference bias circuits were selected for use in the processor arrays. Development continued on high yield microcircuit and multilevel interconnection techniques. Preliminary design of a multilevel process evaluation chip was completed. Thermal studies of discretely packaged high power 1 watt LSI chips were made using a thermal test chip as a vehicle. Final design of a 256-bit read-only memory array was completed. The photomasks were all generated using computer aid.

Descriptors:

• *INTEGRATED CIRCUITS
• *COMPUTER LOGIC
• GATES(CIRCUITS)
• MASKING
• MEMORY DEVICES
• MICROELECTRONICS
• LOGIC CIRCUITS
• MANUFACTURING

Subject Categories:

• Electrical and Electronic Equipment
• Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE