Accession Number:

AD0688288

Title:

ALLOY FOR BONDING METALS TO CERAMICS,

Descriptive Note:

Corporate Author:

ARMY FOREIGN SCIENCE AND TECHNOLOGY CENTER WASHINGTON D C

Personal Author(s):

Report Date:

1969-03-10

Pagination or Media Count:

5.0

Abstract:

The report discusses the application of a titanium-base alloy containing nickel and silicon for bonding metal to ceramic materials. To reduce the bonding temperature and improve the bonds, beryllium is used as a partial or full substitute for silicon. In a variant, 0.1-2.0 beryllium or beryllium with silicon are added to alloy containing 24-36 nickel. To improve the mechanical properties of bonds, up to 10 copper is added to the alloy composition. Author

Subject Categories:

  • Adhesives, Seals and Binders
  • Ceramics, Refractories and Glass
  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE