Accession Number:

AD0679560

Title:

SEMICONDUCTOR PROCESSING APPLIED TO INTEGRATED CIRCUIT FABRICATION

Descriptive Note:

Technical note

Corporate Author:

MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Personal Author(s):

• Cohen, Ronald A.
• Mountain, Robert W.

Report Date:

1968-08-26

Pagination or Media Count:

30.0

Abstract:

The note describes the processing steps and technical considerations involved in fabricating bipolar integrated circuits. Basic processes and examples of the use of these to fabricate semiconductor devices are illustrated. A bibliography of basic references to the technology and a short list of current, useful textbooks on the present state of the art are also included.

Descriptors:

• *INTEGRATED CIRCUITS
• BONDING
• DIFFUSION
• ELECTRICAL INSULATION
• EPITAXIAL GROWTH
• MANUFACTURING
• METAL COATINGS
• OXIDATION
• PHOTOENGRAVING
• PROCESSING
• SEMICONDUCTORS
• SILICON
• SINGLE CRYSTALS

Subject Categories:

• Electrical and Electronic Equipment
• Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE