Accession Number:

AD0673745

Title:

STUDY OF MICROMECHANICAL PROPERTIES OF ADHESIVE-BONDED JOINTS.

Descriptive Note:

Final rept. 30 Jun 67-29 Jun 68,

Corporate Author:

GENERAL PRECISION SYSTEMS INC LITTLE FALLS N J AEROSPACE RESEARCH CENTER

Personal Author(s):

Report Date:

1968-08-01

Pagination or Media Count:

76.0

Abstract:

The basic purpose of this program was to demonstrate the feasibility and utility of making microstrain measurements to establish the mechanical properties of adhesives in metal-metal bonds. Loading modes were tension, compression and shear as a function of joint thickness and test temperature for selected adhesive systems. A high sensitivity capacitance-type extensometer was used to measure the deformation. The following accomplishments were achieved 1 Tensile mechanical properties of epoxy adhesives in bulk form are different from the epoxy in a metal bonded joint. 2 The tensile modulus increases with decreasing thickness, increasing strain rate, lower test temperature, higher modulus adherends. 3 The shear modulus increases with decreasing test temperature, increasing strain rate and is independent of thickness in the range of 0.004 to 0.040 inches. 4 The precision elastic limit and the viscoelastic behavior are affected by composition, test temperature and stress level. 5 Several systems showed work hardening. These techniques and results have provided new insights into the deformation characteristics of epoxy adhesives in metal bonded joints. Author

Subject Categories:

  • Adhesives, Seals and Binders
  • Plastics
  • Mechanics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE