THIN-FILM HYBRID MICROCIRCUIT DESIGN AND LAYOUT.
ARMY ELECTRONICS COMMAND FORT MONMOUTH N J
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This report describes the variety of techniques utilized by the Thin-Film Techniques Section of the Integrated Electronics Division, Electronic Components Laboratory, USAECOM, for the production of thin-film hybrid microcircuits. Each major step in producing such circuits is described, utilizing results from internal work and related information from USAECOM-supported contracts and literature sources. The emphasis in this report is on the role of the hybrid microcircuit designer and his interaction with the electronic circuit designer and thin-film fabrication specialists. The overall report is intended to provide the electronic circuit and equipment design engineer with an understanding of the capabilities and limitations of thin-film hybrid microcircuits and the design principles and practices involved. Such an understanding will help to guide his selection of the most appropriate microelectronic approach for a particular application. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems