Accession Number:

AD0671879

Title:

THERMOCOMPRESSION BONDING OF GOLD WIRE FOR MICROELECTRONIC CIRCUITS,

Descriptive Note:

Corporate Author:

NAVAL AVIONICS FACILITY INDIANAPOLIS IND

Personal Author(s):

• Higbie,Thomas E.

Report Date:

1967-10-26

Pagination or Media Count:

35.0

Abstract:

The report details a technique for interconnecting master die integrated circuits using thermocompression bonding. Primary coverage is given to specific results achieved and the techniques used. Author

Descriptors:

• (*INTEGRATED CIRCUITS
• *SPOT WELDING)
• (*DIFFUSION BONDING
• *GOLD)
• SEMICONDUCTOR DEVICES
• SUBSTRATES
• TEMPERATURE
• TIME
• PRESSURE
• STATISTICAL ANALYSIS
• PHYSICAL PROPERTIES
• MANUFACTURING

Subject Categories:

• Electrical and Electronic Equipment
• Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE