Accession Number:

AD0671879

Title:

THERMOCOMPRESSION BONDING OF GOLD WIRE FOR MICROELECTRONIC CIRCUITS,

Descriptive Note:

Corporate Author:

NAVAL AVIONICS FACILITY INDIANAPOLIS IND

Personal Author(s):

Report Date:

1967-10-26

Pagination or Media Count:

35.0

Abstract:

The report details a technique for interconnecting master die integrated circuits using thermocompression bonding. Primary coverage is given to specific results achieved and the techniques used. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE