A GENERAL COMPUTER PROGRAM FOR EVALUATION OF TEMPERATURE PROFILES AND INTERFACE POSITION IN FILAMENTS UNDERGOING SOLIDIFICATION.
AEROSPACE RESEARCH LABS WRIGHT-PATTERSON AFB OHIO
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A computer program is described for numerical evaluation of temperature profiles and interface position as a function of time for cylindrical filaments undergoing solidification. The method is outlined for cooling and solidification of a moving filament of molten polymer however, unsteady-state heat transfer in two-phase systems can be studied with the same program. Boundary conditions include the effect of convective and radiative energy losses. The program listing is given in FORTRAN IV. Author
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