MODELING OF INTEGRATED CIRCUIT EFFECTIVENESS (MICE).
RADIO CORP OF AMERICA CAMDEN N J DEFENSE ELECTRONIC PRODUCTS
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A Stress Survival Matrix Test SSMT and Physical Effects Analysis PEA program was conducted on a type of monolithic silicon integrated circuit from two vendors. The purposes of the program were to identify the basic reliability characteristics of integrated circuits and determine an approach to reliability prediction having greater practicality and validity than the currently used techniques. The development of the SSMT, analysis of the resulting data, and the PEA results are described. It is shown that the reliability of suitably used integrated circuits is not primarily a function of usage factors such as temperature, power or shock. It is more directly dependent on 1 screening effectiveness, 2 the failure mechanisms which exist in field use units and 3 the life distributions and environmental susceptibilities of the units which have these failure mechanisms. These results suggest that failure rate decreases with time as the deviate units i.e., those containing failure mechanisms drop out of the population of survivors. The problem of assuring suitable usage is discussed. Finally an appropriate prediction approach, incorporating the pertinent factors that affect reliability, is identified. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems