Accession Number:

AD0658134

Title:

PRELIMINARY RESULTS OF THERMAL SHOCK TESTS ON PRINTED WIRING,

Descriptive Note:

Corporate Author:

JOHNS HOPKINS UNIV SILVER SPRING MD APPLIED PHYSICS LAB

Personal Author(s):

Report Date:

1953-07-23

Pagination or Media Count:

9.0

Abstract:

Two printed wiring XXXP Formica boards fabricated by the photo-etching process were put through fifty cycles of thermal shock by lowering the temperature to -40F. and then raising the temperature as quickly as possible to 200F. Power was applied to the 10 circuits on each board at all times. No lifting, cracking, or breaking of the circuits was observed. The plastic remained unharmed. A slight rolling of the plug contacts was noted. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE