STUDY OF MICROMECHANICAL PROPERTIES OF ADHESIVE BONDED JOINTS.
Bimonthly progress rept. no. 3, 1 May-30 Jun 67,
GENERAL PRECISION INC LITTLE FALLS N J AEROSPACE RESEARCH CENTER
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The objective of the program is to demonstrate the feasibility of using a microstrain technique for measuring the mechanical properties of epoxy adhesives in thin film joints in tension, compression and shear. The report includes a summary of the progress during the first four months of this contract. During the current report period, the principal effort was devoted to the shear tests the following accomplishments were achieved To account for friction losses in the loading chain sprockets, a new load cell had to be built and mounted next to the torsion sprocket The correction factor accounting for deformation in the adherends was established The shear modulus for the principal epoxy system was found to be 388,000 plus or minus 30,000 psi The material deformed elastically, with no evidence of visco-elasticity prior to fracture Fracture stresses varied from 5600 to 7180 psi The fracture was principally adhesive and was characterized by cracks in the epoxy. The results obtained to date represent a significant advance in the techniques available for measuring deformation characteristics of adhesives in actual joints. Such results should be extremely useful for an understanding of the mechanical behavior of adhesives. Author
- Adhesives, Seals and Binders
- Structural Engineering and Building Technology