ANALYSIS OF INTEGRATED CIRCUIT PACKAGE INTEGRITY USING HELIUM LEAK DETECTION TECHNIQUES
ROME AIR DEVELOPMENT CENTER GRIFFISS AFB NY
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Current integrated circuit packaging techniques, a compilation of applicable package hermeticity testing techniques, and the required theoretical fluid flow background necessary to evaluate integrated circuit package integrity, are presented. The basic types of integrated circuit packages are described with the emphasis placed on defects in package construction and hermetic sealing techniques which can influence package integrity. A general description of standard hermeticity tests is given, and their inherent limitations, when used in determining integrated circuit package leak rates, are discussed. The helium leak detection system and test procedures for package leak rate measurements dVdt-std.ccHesec. are described. A complete review and analysis of the classical steady state helium gas flow rate equations are given. The time dependence corrections to the classical flow laws, required when an enclosed volume e.g. and IC flat pack is imposed on the system are derived and applied to the helium leak detection technique. The analysis includes a detailed determination of equivalent hole diameters based on the measured package leak rate. The importance of obtaining a hermetically sealed package with reference to integrated circuit reliability is then discussed. In the classical steady state gas flow analysis, the derivation of the free- molecular flow rate law is noteworthy. The specific approach taken in deriving this gas flow rate law allows a determination of the variation in the molecular flow rate magnitude at points within a cross-sectional plane of a cylindrical tube.
- Electrical and Electronic Equipment
- Test Facilities, Equipment and Methods