LOW COST INTEGRATED CIRCUIT TECHNIQUES
Final rept. no. 5, 15 Jun 1965-14 Sep 1966
PHILCO-FORD CORP LANSDALE PA MICROELECTRONICS DIV
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An over-all process was developed for glass coating of silicon integrated circuit chips and batch attaching them to an appropriately processed substrate. The techniques developed were demonstrated by delivery of four 10-chip arrays consisting of glassed silicon micro-circuits flip-chip assembled on a plug-in printed circuit board. Detailed information is provided concerning wafer glassing and other processing leading to flip-chip assembly. In addition to the delivery of the final exploratory development models, other development units were fabricated and subjected to a test sequence intended to demonstrate the effectiveness of the developed process. Although the assignment of a quantitative failure rate was considered unrealistic because of the limited sample size, the analysis of the test data led to the conclusion that no catastrophic or major deleterious effects result from the combined glass and batch assembly process.
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass