Accession Number:

AD0647947

Title:

THIN FILM MICROCIRCUIT INTERCONNECTIONS.

Descriptive Note:

Final rept. no. 4, 1 Jul 65-31 Aug 66,

Corporate Author:

BENDIX CORP BALTIMORE MD BENDIX RADIO DIV

Report Date:

1967-01-01

Pagination or Media Count:

534.0

Abstract:

An evaluation was made of thin film interfacial interconnections and insulating crossovers. The interconnections were subjected to -55C, 125C, and 200C storage for 1000 hrs. 100 thermal cycles from -65C to 125C and an accelerated aging at 240C Interfacial Interconnections or 300C crossovers. In addition, the interfacial interconnections were subjected to an operational life test and the crossovers to an operational humidity cycling test. The adhesion and compatability of the film combinations were studied. Eight interfacial combinations were investigated. The fabrication, measuring, analytical, and evaluation techniques are discussed. Based on these studied, several criteria have been established for the evaluation of interfacial interconnections. Based on these studied, several criteria have been estabfor the evaluation of interfacial interconnections. The electrical parameters studied were the d.c. and a.c. interfacial resistance, the rectification ratio, and the current carrying capability of the interconnection. Five combinations are equally acceptable and recommended for use. They are top conductor first CrCrAu, CrAuCrAu, AlTaAl, CrAuCr, AlCr. Three are unacceptable, and not recommended for use. They are TaAlCrAu, AlCrAu, CrAuTaAl. The crossover geometry, along with the measuring and analytical techniques are discussed. The electrical parameters studied were the d.c. insulation resistance, the 1000 Hz capacitance and dissipation factor, the d.c. breakdown voltage and the withstanding voltage. Several criteria have been established for the evaluation of crossovers.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE