Accession Number:

AD0647137

Title:

INDUSTRIAL SURVEY OF ELECTRONIC PACKAGING,

Descriptive Note:

Corporate Author:

BATTELLE MEMORIAL INST COLUMBUS OHIO COLUMBUS LABS

Personal Author(s):

• Easterday,J. L.
• Kaiser,Da. A.
• Burley,C. H.

Report Date:

1966-11-01

Pagination or Media Count:

134.0

Abstract:

The report reviews a survey of 17 industries on current techniques for packaging electronic equipment. Subjects covered include module configuration, package configuration, package housing, interconnection techniques, and potting compounds. Information provided is a review of electronic packaging techniques ranging from the mounting of parts discrete or integrated circuit to a complete black box. Module configurations discussed include planar printed-circuit boards, stick modules, cordwood, mylar tapes for part mounting, and variations of these. Package configurations have been aimed at reducing the number of layers in multilayer printed-circuit boards. Techniques include book type modules interleaving printed-circuit boards, slotted guides in housings, and precompressed stacks of printed-circuit board assemblies. The package housings may be cast, dip brazed, automatically milled from solid stock, or light sheet metal covers. Many types of interconnection techniques are in use including multilayer circuitry other than conventional printed-circuit boards. Eyelets and plated-through holes are usually reinforced by filling, redundancy, etc. No great variations in potting methods were noted except for radio frequency modules. However, problems of nonuniform density were indicated. Author

Descriptors:

• *ELECTRONIC EQUIPMENT
• *MODULES(ELECTRONICS)
• *MICROELECTRONICS
• PACKAGING
• INTEGRATED CIRCUITS
• CIRCUIT INTERCONNECTIONS
• EMBEDDING SUBSTANCES
• CONFIGURATIONS

Subject Categories:

• Electrical and Electronic Equipment
• Containers and Packaging

Distribution Statement:

APPROVED FOR PUBLIC RELEASE