Accession Number:

AD0645222

Title:

PROCEEDINGS OF THE CONFERENCE ON RELIABILITY OF SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS, VOLUME II, 17, 18 AND 19 JUNE 1964, NEW YORK, N. Y.

Descriptive Note:

Corporate Author:

OFFICE OF THE DIRECTOR OF DEFENSE RESEARCH AND ENGINEERING WASHINGTON DC ADVISORY GROUP ON ELECTRON DEVICES

Personal Author(s):

Report Date:

1964-06-19

Pagination or Media Count:

205.0

Abstract:

Contents Elimination of gross particles A closure welder for nontubulated semiconductors Development and application of hot hydrogen mounting furnace Development and application of accelerated temperature testing Analytical empirical surface studies The chemistry and physics of semiconductor reliability Reliability improvement of germanium electrochemical transistors Statistical analysis of electronic parts reliability test data Reliability improvement of electrochemical transistors Step stress test for high power transistors Life testing methods employed to demonstrate reliability improvement Establishment of optimum diffusion control Uniform metal evaporation Small ball bonding Process surveillance a tool for improving in-process quality conformance.

Descriptors:

• *RELIABILITY(ELECTRONICS)
• *SEMICONDUCTOR DEVICES
• *INTEGRATED CIRCUITS
• SYMPOSIA
• RELIABILITY(ELECTRONICS)
• RELIABILITY(ELECTRONICS)
• TRANSISTORS
• WELDING
• SEMICONDUCTORS
• FURNACES
• TEMPERATURE
• SURFACES
• GERMANIUM
• PLATING
• BONDING
• QUALITY CONTROL
• STATISTICAL ANALYSIS

Subject Categories:

• Electrical and Electronic Equipment
• Fabrication Metallurgy
• Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE