LOW COST INTEGRATED CIRCUIT TECHNIQUES.
Quarterly rept. no. 4, 15 Mar-14 Jun 66,
PHILCO CORP LANSDALE PA
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A compatible process was developed for the deposition of glass on integrated circuits metalized to facilitate their face-down solder bonding onto printed circuit boards having appropriate copper interconnection patterns. The over-all process is applicable to standard integrated circuits having conventional aluminum interconnections. To conduct 200C life tests, it was necessary to develop a soldering process for use with a suitable printed circuit board material. All of the test vehicles required for low temperature environmental testing were fabricated and submitted for formal testing. Fabrication was begun of the models necessary for the high temperature 200C tests. Initial evaluation was made of multiple chip assemblies. Several 10-chip arrays were prepared using standard microcircuit chips assembled by the process developed on this program. It has been shown that chips can be removed and new ones attached at the same positions prior to the application of epoxy coating for mechanical protection. This repairability enhances the application of this assembly technique to complex functions. Author
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass