Accession Number:

AD0643122

Title:

MICROMINIATURIZATION MULTIPLANE INTERCONNECTION.

Descriptive Note:

Quarterly rept. no. 3, 1 Jan-30 Jun 66,

Corporate Author:

HUGHES AIRCRAFT CO FULLERTON CALIF

Personal Author(s):

Report Date:

1966-11-01

Pagination or Media Count:

187.0

Abstract:

The study has shown that an assembly of unmodified MCMs is thermally limited to 3 circuits per standard MCM using air cooling and a reasonable size blower based upon 75C junction and 50C ambient. The addition of an external finned stud .5 inches high permits a maximum of 4 circuits per standard MCM with the same blower. If a shallow assembly of approximately 3.75 in. can be tolerated, the quantity of circuits can be increased to 5 per module with finned MCMs. If the design junction temperature is increased to 125C, the quantity of circuits per MCM may be increased to 12 or 16, depending on the blower size selected. Thermal considerations of the sandwich module shows that only the bottom of the flat package need to be bonded. This is because virtually all of the heat is transferred through the bottom of the package. The following approaches are being considered 1 Direct air cooling using a centrifugal fan, 2 Direct air cooling using a tubeaxial fan, 3 Intermediate liquid cooling, 4 Ebullition or two phase cooling, 5 Mechanical refrigeration, 6 Thermoelectric cooling. The Fairchild ECL gate remains the preferred circuit for the assembly. Tests on this gate show that the average input capacitance is 4.20 pf, and the noise margins are for the NOR 165 mv and OR 37 mv. These gates, as a latch flip-flop, can work up to 250 Mc.

Subject Categories:

  • Electrical and Electronic Equipment
  • Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE