EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.
Interim development rept., 14 Oct 65-14 Jan 66.
COMPUTER CONTROL CO INC FRAMINGHAM MASS
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The initial study of some of the basic constraints to be applied to FlipChip modules has been completed. Masks for the preparation of experimental samples have been designed and sample substrates and chips are being prepared. Ultrasonic welding equipment has been installed and is operational. A few samples have been bonded. Author
- Electrical and Electronic Equipment