CORWOOD MODULE EVALUATION AND RELIABILITY PROGRAM.
REPUBLIC AVIATION CORP FARMINGDALE N Y ELECTRONIC PRODUCT REQUIREMENTS
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Three facts emerge as the most significant results of the overall module evaluation program 1 It was conclusively demonstrated that the RAC Cordwood Module packaging technique does not degrade the reliability of electronic piece parts in a time-temperature enviornment, and increases the reliability of these parts in a shock andor vibration environment, compared to the reliability of the same parts in a free-air mounting. 2 It appears that there is an optimum time-temperature conditioning cycle that will miximize the resistance of the modules to a thermal stress. 3 It was shown that the results of stress-strength testing correlate to a high degree with those of life testing. The operational life test showed that the inverter modules had a MTBF five times greater than that of the flip-flop modules. Under stress-strength testing, the inverter modules proved to be more resistant to thermal stress, more uniform in their strength characteristic, and to have a more stable strength characteristic than the flip-flop modules.
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