PHYSICS OF FAILURE IN ELECTRONICS. VOLUME 4
ROME AIR DEVELOPMENT CENTER GRIFFISS AFB NY
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The purpose of the meeting was to exchange information on fundamental physical and chemical processes which contribute to degradation, aging, and failure of electronic parts and materials. Emphasis was placed on the application of this information to the problems of reliability control, measurement, prediction, and improvement. Papers were presented at six half-day sessions as follows Session I - Interconnections Session II - Test, Analysis, and Correlation Session III - Device Physics Session IV - Surface Effects Session V - Bulk Effects Session VI - Minuteman II CQAP Program. Included in this volume are also a number of standby papers which were not presented at the symposium.
- Manufacturing and Industrial Engineering and Control of Production Systems