PRODUCTION ENGINEERING MEASURES (PEM) FOR MILLIWATT LOGIC SEMICONDUCTOR INTEGRATED CIRCUITS.
Quarterly progress rept. no. 7, 1 Jan-30 Mar 66.
TEXAS INSTRUMENTS INC DALLAS
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A bonder certification program was initiated during the last quarter of 1865 to improve process flow by reducing pre-cap inspection requirements. Tests completed in December, 1965, resulted in fabrication of a new scribe head with an improved Tempress diamond, which resulted in increased yields and permitted the operator to make necessary adjustments. Work continued on adjusting millivolt offset between a minimum of 15 and a maximum of 50. This program was continuing at the end of the quarter. Pyrolytic oxide was added after emitter to improve contact probe yields and increase pinhole protection. This process was added to the production process. Permission was granted to Texas Instruments on February 9, 1966, by the sponsoring agency to start a qualification program. The first automatic probe system from the Transistor Automation Corporation was delivered the latter part of February, 1966. It was in full operation by March 1, 1966. Author
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