PRODUCTION ENGINEERING MEASURES (PEM) FOR MILLIWATT LOGIC SEMICONDUCTOR INTEGRATED CIRCUITS.
Quarterly progress rept. no. 6, 1 Oct-31 Dec 65.
TEXAS INSTRUMENTS INC DALLAS
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A bonder certification program was initiated during the fourth quarter to improve process flow by reducing pre-cap inspection requirements. A study initiated in October resulted in fabrication of a new scribe head with an improved Tempress diamond, which resulted in increased yields and permitted the operator to make necessary adjustments. Corrective action trials were initiated in the gold doping process with different N2 bake temperatures, diffusion times, and evaporation charges. This program was continuing at the end of the quarter. Double coat - double expose processes were tested at fourth contact etch, resulting in a 95 percent reduction in oxide pinholes. This process was added to the production process in December. Transistor Automation Corporation of Cambridge, Mass. was engaged to design a new, fully automatic functional probing machine. Work is continuing on the machine design and fabrication. A tape programmed d-c test machine was placed in operation in the final test area and additional machines were ordered. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems
- Solid State Physics