Accession Number:
AD0633723
Title:
MICROBONDS FOR HYBRID MICROCIRCUITS
Descriptive Note:
Progress rept. no. 8, 1 Nov 1965-31 Jan 1966
Corporate Author:
HAMILTON STANDARD BROAD BROOK CT ELECTRONICS DEPT
Personal Author(s):
Report Date:
1966-05-01
Pagination or Media Count:
113.0
Abstract:
The mechanical strengths 1 0.001 inch A1 wire ultrasonically bonded to AuCr films on as-fired alumina, 2 0.005 inch Au wire resistance welded to AuCr films on sapphire, 3 0.002 inch Au wire resistance welded to AuCr films on beryllia, 4 0.005 inch inch wire resistance welded to AuCr films on beryllia, 5 0.001 inch A1 wire ultrasonically bonded to AuCr films on sapphire, 6 0.002 inch A1 wire ultrasonically bonded to AuCr films on sapphire and 7 0.002 inch A1 wire ultrasonically bonded to AuCr films on beryllia were evaluated. The reliability goal of an expected failure of no more than 3 bonds per thousand at the 90 confidence level was met for the no. 3 and 4 microbonds. Electrical resistance measurements demonstrated that all bonds completed to date met the contractual goal. Thermal aging tests indicated that a number of bond types met the contractual goal for a temperature of 125C, and of these all but one met the goal at 200C. Stack welded microbonds consisting of 0.002 in. Au-plated-Ni wire welded to NiAuCr films on alumina were completed and the maximum number of expected bond failures was 5 per thousand.
Descriptors:
Subject Categories:
- Electrical and Electronic Equipment