Accession Number:

AD0633723

Title:

MICROBONDS FOR HYBRID MICROCIRCUITS

Descriptive Note:

Progress rept. no. 8, 1 Nov 1965-31 Jan 1966

Corporate Author:

HAMILTON STANDARD BROAD BROOK CT ELECTRONICS DEPT

Personal Author(s):

Report Date:

1966-05-01

Pagination or Media Count:

113.0

Abstract:

The mechanical strengths 1 0.001 inch A1 wire ultrasonically bonded to AuCr films on as-fired alumina, 2 0.005 inch Au wire resistance welded to AuCr films on sapphire, 3 0.002 inch Au wire resistance welded to AuCr films on beryllia, 4 0.005 inch inch wire resistance welded to AuCr films on beryllia, 5 0.001 inch A1 wire ultrasonically bonded to AuCr films on sapphire, 6 0.002 inch A1 wire ultrasonically bonded to AuCr films on sapphire and 7 0.002 inch A1 wire ultrasonically bonded to AuCr films on beryllia were evaluated. The reliability goal of an expected failure of no more than 3 bonds per thousand at the 90 confidence level was met for the no. 3 and 4 microbonds. Electrical resistance measurements demonstrated that all bonds completed to date met the contractual goal. Thermal aging tests indicated that a number of bond types met the contractual goal for a temperature of 125C, and of these all but one met the goal at 200C. Stack welded microbonds consisting of 0.002 in. Au-plated-Ni wire welded to NiAuCr films on alumina were completed and the maximum number of expected bond failures was 5 per thousand.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE