MICROBONDS FOR HYBRID MICROCIRCUITS.
Progress rept. no. 7, 1 Aug-31 Oct 65,
HAMILTON STANDARD DIV UNITED AIRCRAFT CORP BROAD BROOK CONN
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Mechanical strengths of Type E 0.001 inch Au wire resistance welded to AuCr films on Vycor, Type G 0.001 inch Au wire resistance welded to AuCr films on glazed alumina, and Type A2 0.002 inch Au wire resistance welded to AuCr films on sapphire microbonds were evaluated. The reliability goal of an expected failure of 3 bonds per 1000 at a 90 confidence level was not met. However, 95 of the failures can be attributed to poor film adhesion. Electrical resistance measurements on Bond Types E, F, G, H, A1 and A1 showed that all bond types met the contractual goal of SCL-7746A. After thermal shock, only the Type H bonds increased in resistance by more than 10, the reliability goal. The pull strengths were somewhat lower approximately 11 per cent lower in the worst case after thermal cycling. The initial weld schedule development for resistance welding of goldplated nickel riser wires to NiAuCr films on alumina Type V microbonds indicated that much stronger welds were obtained than with copper riser wires. The shear pull strength of the gold-plated nickel riser wire bonds was near the pull strength of the wire itself. Author
- Electrical and Electronic Equipment
- Fabrication Metallurgy