Accession Number:

AD0632848

Title:

THIN FILM TECHNIQUES FOR SILICON INTEGRATED CIRCUITS.

Descriptive Note:

Quarterly technical progress rept. no. 5, 1 Aug-31 Oct 65,

Corporate Author:

MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV

Personal Author(s):

Report Date:

1966-04-01

Pagination or Media Count:

31.0

Abstract:

During the past quarter the following was accomplished 1 Modification of the cermet-evaporation system with respect to powder feed, resistance and film rate monitoring, and electron gun orientation to obtain more uniform deposition characteristics. 2 Design of a new resistor test mask set to permit more rapid and more exact measurement of resistor films. 3 Continued investigation as to the best method of depositing aluminum for use as a thin film capacitor lower conductor either by itself or in combination with other materials such as tantalum or titanium. 4 Ordering the necessary equipment to r-f sputter dielectric films. 5 Improvement of film thickness measurement techniques using the ellipsometer and interferometer. 6 Continuation of the 1000-hour life tests on the compatibility vehicles consisting of a thin film resistor, transistor, and capacitor and 7 Acquisition and use of equipment to study methods of making high frequency measurements of thin film components. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE