MICROMINIATURIZATION MULTIPLANE INTERCONNECTIONS.
Quarterly technical progress rept. no. 1, 1 Jul-30 Sep 65,
HUGHES AIRCRAFT CO FULLERTON CALIF
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The purpose of this work is the development of interconnections for ultrahigh-speed-Micro-Circuit Module arrays. Four module packaging approaches for ultra high speed circuits, along with a new packaging technique, are presented and compared. High complexity arrays are discussed and analyzed from the viewpoint of cost and performance. Progress on the subassembly and assembly and assembly designs is described. Various power requirements and delay measurements on the ultra-high-speed gate are given. Author
- Electrical and Electronic Equipment