MICROMINIATURIZATION MULTIPLANE INTERCONNECTIONS.
Progress rept. no. 2, 1 Oct-31 Dec 65,
HUGHES AIRCRAFT CO FULLERTON CALIF
Pagination or Media Count:
The purpose of this work is the development of interconnections for ultra-high-speed MICRO-CIRCUIT MODULE ARRAYS. The MCM passive crosstalk analysis and measurements are presented. From these results, the MCM must use matched lines with characteristic impedances below 400 ohms if crosstalk is to be below 10 over the frequencies of interest. Progress on the subassembly and assembly designs is described. Various delay measurements on the ultra-high-speed gate, show that the system delay will be below 5 nanoseconds, if less than plus or minus 15 change in line impedance is maintained. Thermal resistance from circuit to case has been analyzed, and with the present chip size 40 x 40 mils it will be below 13 CW. Author
- Electrical and Electronic Equipment
- Active and Passive Radar Detection and Equipment