MICROBONDS FOR HYBRID MICROCIRCUITS.
Quarterly progress rept. no. 6, 1 May-31 Jul 65,
HAMILTON STANDARD DIV UNITED AIRCRAFT CORP BROAD BROOK CONN
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The overall objective of the program is development of reliable high yield processes for bonding fine wires of gold and aluminum to gold-chromium and aluminum films on various substrates such as alumina, sapphire, and oxidized silicon. The reliability goal of a maximum expected failure rate of 3 bonds per 1000 at a 90 confidence level was demonstrated for type H microbonds 0.001 inch gold wire resistance welded to gold-chromium film on oxidized silicon. Preliminary bonding of riser wires to edge terminations of NiAuCr films on as-fired alumina Type V microbonds was initiated. It was found that use of gold-plated copper matrices resulted in low mean pull strength. A survey of available flap-pack lead material and multilayer circuit boards was started. Sample welds made with a parallel-gap resistance welder were investigated but no conclusions could be drawn. The investigation of flip-chip bonding, was continued on a limited basis. However, the preliminary results using a soldering technique indicated the bonds were not as reliable as desired and that other bonding techniques such as ultrasonic bonding should be investigated.
- Electrical and Electronic Equipment