INTEGRATED CIRCUITS FOR FIELDATA COMPUTERS.
Quarterly technical rept. no. 1, 1 Jul-30 Oct 65,
MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV
Pagination or Media Count:
MATERIALS AND PROCESSES Two dielectric isolation methods were explored for implementation of circuits. These are 1 thermally grown silicon dioxide with a polycrystalline silicon matrix, and 2 glass isolation with a dummy silicon support slice. The latter technique appears most applicable because of still lower capacitances to the substrate. The glass isolation lends itself to the simpler implementation of beam-lead technology if desired. CIRCUITS Emitter current-steered ECL and saturating high speed TTL circuit configurations were explored, both with the view toward obtaining the required speedpower product. The circuits were also considered from the point of view of radiation hardening possibilities. The present activities are directed toward the use of the TTL logic function. Linear high frequency amplifier studies were performed and evaluations made as to implementation utilizing dielectric isolation techniques. Author
- Electrical and Electronic Equipment