Accession Number:

AD0628907

Title:

THERMAL CRACKING OF WAVEGUIDE WINDOWS

Descriptive Note:

Technical note

Corporate Author:

MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Personal Author(s):

Report Date:

1966-02-09

Pagination or Media Count:

12.0

Abstract:

A theory is derived to explain the cracking of waveguide windows due to stresses generated by heat dissipated in the window when subject to the RF fields in a waveguide. Calculations of the temperature rise and power-handling ability of half-wavelength block windows at X-band are presented.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE