RESEARCH AND DEVELOPMENT LOW COST INTEGRATED CIRCUIT TECHNIQUES.
Quarterly progress rept. no. 1, 15 Jun-14 Sep 65,
PHILCO CORP LANSDALE PA
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The use of an adherent impervious coating for encapsulating silicon integrated circuits, combined with a batch mounting and interconnection technique, will result in 1 decreased cost as a result of package elimination 2 increased packing density 3 improved reliability due to reduction in the number of contacts and elimination of Au-Al thermocompression bonds. This report describes a technique for selective deposition of 1 to 2 micron thick glass on silicon integrated circuits and attaching these circuits to a printed circuit board by means of flip chip mounting. Glass has been deposited by means of evaporation and pyrolytic vapor plating. Evaporation appears to have some advantages. Evaluation of two high temperature metalization systems Ti-Ag-Ti and Cr-Ag-Cr has indicated satisfactory properties. A test model employing these techniques has been designed for environmental testing and technique evaluation. Author
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass