THIN FILM MICROCIRCUIT INTERCONNECTIONS.
Quarterly rept. no. 1, 1 Jul-30 Sep 65,
BENDIX RADIO DIV BENDIX CORP BALTIMORE MD
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Two patterns for interfacial interconnections and one pattern for the electrically insulating crossovers were designed. Masks were fabricated for these patterns which make possible, in a single deposition sequence, the fabrication of 440 interfacial interconnections or 1512 insulating crossovers. Processing specifications for the deposition of chromium-gold, chromium, and aluminum were established. A measurement technique and procedure were devised and proven for the accurate measurement of small D. C. voltages. Interfacial interconnections of the combinations chromium over chromium-gold, chromium-gold over chromium, chromium-gold over chromium-gold, aluminum over chromium-gold, and aluminum over chromium, were fabricated, tested, and evaluated. A qualitative estimate of the interfacial resistance corresponding to these conductor combinations was made. Preliminary adhesion tests were performed. Author
- Electrical and Electronic Equipment
- Fabrication Metallurgy