THIN FILM MICROCIRCUIT INTERCONNECTIONS.
HUGHES AIRCRAFT CO NEWPORT BEACH CALIF
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A program of study of deposited thin film interfacial connections and electrical crossovers was completed. Test patterns were designed which permit the study of the interconnection and the crossover with minimal intrusion from contacts and film properties. Processes for the deposition of a variety of materials were developed. Design criteria were established for these materials combinations which are compatible for the purposes of thin film interconnections and crossovers. The use of these criteria can be effective in judging the ability of candidate materials combinations and the ability of each to perform the thin film function. The accuracy of these criteria to perform the task of forecasting the ability of any interconnection or crossover to function in military environments was verified statistically. As a result of the program, all the materials combinations are placed in forced rank according to their relative merits. The reasons for each choice are given. Author
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems