A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS.
Interim development rept. no. 11, 1 Mar-31 May 65,
WESTON INSTRUMENTS INC NEWARK N J
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A new method of soldering a terminal onto the porous substrate was attempted with encouraging results. This terminating method allows the metallizing to be performed prior to termination. The advantage is that better solution penetration during metallizing results if the surface of the substrate is not masked by terminals. A new cylindrical shaped substrate was successfully tried as a replacement for the old style. The new substrate measures 0.25 in diameter and 0.40 in length as compared to the old style that measures 0.30 X 0.30 X 0.40. The new shape substrate is molded of the same material as the old style Filtros Inc. Type K. Author