MICROELECTRONIC PACKAGING CONCEPTS.
Final technical rept. for 1 Jan-31 Dec 64,
WESTINGHOUSE ELECTRIC CORP BALTIMORE MD SURFACE DIV
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All aspects of microcircuit packaging are studied and each of the three basic approaches to the packaging of microcircuits are investigated and evaluated. These three approaches are 1 TO-type containers, 2 glass and metal flat packages, 3 encapsulated type packages. Evaluation is done in the areas of thermal properties, frequency limitations, form factor and ease of interconnection, reliability and cost. Construction details for each type of package are discussed and various commercially available microcircuit packages are cataloged. Thermal ratings of circuit packages are formulated with regard to power dissipation per circuit and allowable power densities in the system. Testing procedures are outlined to allow the thermal characterization of any microcircuit package. In this area, several curves are given showing the variation in case-to-ambient thermal resistance as a function of air flow and system power density. Conclusions are then drawn concerning the relative merits of each packaging approach. Author