DETERMINATION OF INTERFACIAL ENERGIES BETWEEN SOLID COPPER AND BINARY BISMUTH-THALLIUM LIQUID METAL COMPOSITIONS
FRANKFORD ARSENAL PHILADELPHIA PA
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Interfacial energies were determined at 1250 F, 950 F, and 650 F between solid copper and binary bismuththallium liquid metal alloys. Interfacial energies were determined between the copper and the liquid metal environment as the relative proportions of bismuth and thallium in the liquid metal were varied. Results showed that progressive additions of thallium to bismuth raises the interfacial energies between the resulting liquid metal environments and the solid copper. Interfacial energy values calculated for 1250 F ranged from 278 ergssq cm for a liquid metal composition of 100 per cent bismuth to 360 ergssq cm for a composition of 100 per cent thallium. Interfacial energies between solid copper and liquid bismuth-thallium environments increase as the temperature decreases in the range of 1250 F to 650 F. The effect of thallium on increasing the interfacial energy becomes more pronounced as the temperature decreases.
- Metallurgy and Metallography
- Inorganic Chemistry