FABRICATION AND TESTING OF CRYOGENIC ASSOCIATIVE PROCESSOR PLANES.
Final technical rept. for 5 May-13 Dec 64,
TEXAS INSTRUMENTS INC DALLAS
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Feasibility is established of a unique photomaskphotoresist process for fabrication of a 120-bit, 2350-cryotron associative memory plane. A set of nine photomasks defines the five superconductive and four insulating material layers of the structure. The thin film circuitry occupies a 4 square inch area of a 2.4 inch x 2.4 inch glass substrate. Two hundred and fifty solder lands, 0.007 inch x 0.100 inch on 0.014 inch centers, are suitably grouped around the substrate perimeter for pressure contact with the data link. Seven short-free memory planes were successfully produced with intended signal path continuity, as established by dc tests at 300K and below 3.5K. Difficulties in simultaneously achieving superconductive pressure contact at all solder lands precluded memory operation however, current loop switching and trapping were demonstrated for accessible cryotron circuit segments. Solutions to this unanticipated interconnection problem were subsequently conceived and demonstrated. Author