PRODUCTION ENGINEERING MEASURE TO IMPROVE PRODUCTION TECHNIQUES AAND INCREASE THE RELIABILITY OF THE 2N328A TRANSISTOR.
Final rept. for 30 Jun 63-30 Dec 64,
NATIONAL SEMICONDUCTOR CORP DANBURY CONN
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A summary is given of the work performed for improving the reliability of the PNP Silicon Alloy Transistor Type 2N328A. The following processes were modified during the course of the contract An etch wheel was introduced to more accurately control final device etching Additional bake-out furnaces were introduced and evaluated to increase the amount of time which the units are heated after etching A gas recirculator was introduced into the final dry line to reduce the water vapor concentration Welding shields were introduced at two welding operations while one other process was modified all these changes were made in order to decrease the amount of weld splash striking the active region of the transistor. Devices produced for the first month of operation of the improved manufacturing line were used for the long term reliability testing. Measurements on devices made during this period of manufacture are included. This reliability evaluation consisted of operational tests for a 1000 hours at power levels of 400, 450, and 500 milliwatts A specification for an improved 2N328A type transistor incorporating some of the results of evaluations made during this contract is included. Author