PRODUCTION ENGINEERING MEASURE. RELIABILITY THROUGH PROCESS IMPROVEMENT (EXTENSION TO 2N2525 TRANSISTOR FAMILY).
Quarterly rept. no. 2, 1 Sep-30 Nov 64,
TRW SEMICONDUCTORS INC LAWNDALE CALIF
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Studies on cold-welding as the final closure operation were completed and the die design finalized. The dynamic forces exerted on the welded parts was reduced to a minimum while the tightness of the joints made is maintained. Analytical work was done to establish the residual stresses developed and the modes of failure experienced on ceramic-to-metal semiconductor enclosures the header design was modified. The compression seals to the ceramic achieved by the use of molybdenum feedthrough pins was found to be the most suitable. The emitter lead geometry used in the case of the pin feedthrough for the emitter lead continuity to the external radial leads is highly inductive. The frequency response of the package can be improved substantially by by-passing such an inductive lead geometry and using the flang itself as the emitter contact. Author